TOPPAN Develops Coreless Natural Interposer for Subsequent-Technology Semiconductors—World’s First Supporting Standalone Electrical Inspection

Contributing to vital discount in loss from chip disposal brought on by interposer defects

Tokyo – June 11, 2024 —

TOPPAN Inc. (TOPPAN), a TOPPAN Group firm and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has addressed a problem for heterogeneous integration of semiconductors by growing a high-reliability coreless natural interposer1 for next-generation semiconductors.

With this new coreless natural interposer, TOPPAN has used a cloth with a low coefficient of thermal enlargement (CTE) to strengthen each side of the redistribution layer (RDL). Whereas supporting advantageous pitch interconnections and a low CTE, the easy coreless construction additionally provides rigidity. Which means that the natural interposer itself could be unbiased from the provider, delivering the world’s first natural interposer for which standalone electrical inspection assurance is feasible. Reliability is enhanced, making it potential to contribute to a big discount in loss as a consequence of chip disposal ensuing from interposer defects.

The brand new coreless natural interposer will probably be showcased within the TOPPAN sales space at JPCA Present 2024, which will probably be held on the Tokyo Large Sight worldwide exhibition heart from June 12 to 14.

Background

Heterogeneous integration, wherein a number of several types of chips are built-in on an interposer, is extensively used to reinforce semiconductor efficiency. Silicon interposers are at present the predominant sort, however as a consequence of value issues, development in semiconductor packaging adopting natural interposers is predicted sooner or later. Nevertheless, common natural interposers have poor structural rigidity, and standalone dealing with is troublesome. This imply that they must be fastened to a provider or the like for electrical inspection, and the shortcoming to verify conduction on each the entrance and rear sides in such a state has introduced a problem.

TOPPAN’s new coreless natural interposer for next-generation semiconductors has each side of the RDL bolstered with a low CTE materials. The easy coreless construction helps advantageous pitch interconnections and a low CTE in addition to including rigidity. This makes it potential for the natural interposer to be unbiased of a provider, facilitating standalone electrical inspection assurance of the natural interposer.

If an natural interposer is flawed, the LSI chip onto which it’s mounted additionally must be disposed of. Nevertheless, if the natural interposer has high-reliability and is topic to electrical inspection assurance upfront, will probably be potential to considerably cut back loss as a consequence of disposal of chips.

Illustration of cross-sectional construction of coreless natural interposer
©TOPPAN Inc.

Product options

1) Separating the interposer from the provider in the course of the manufacturing course of makes standalone electrical inspection assurance potential, enhancing reliability and enabling provide as a known-good substrate.
2) The CTE is roughly 45% decrease than standard packaging substrates, making it potential to stop cracks that come up as a consequence of variations between the CTEs of FC-BGA substrates and RDLs.
3) The slender pitch mildew resin through-mold by way of (TMV) construction allows advantageous routing/advantageous interconnection with a minimal connection terminal pitch of 40μm (conventionally 130μm) on the chip aspect and 130μm (conventionally 300μm) on the substrate aspect.
4) As a result of scalability of panel stage manufacturing, massive sizes of greater than 100 mm sq. could be supported.

Future

TOPPAN is aiming for its new product to be adopted for natural interposers and semiconductor packaging substrates for purposes similar to information heart CPUs and AI accelerators. Samples of next-generation semiconductor-packaging-related merchandise together with the brand new construction will probably be out there from fiscal 2027, with the launch of mass manufacturing scheduled for fiscal 2028.

1. An interposer is a substrate used for electrically connecting entrance and rear circuits with through-mold vias. 

About JPCA Present 2024

・Dates & instances: June 12 to 14, 2024 10:00—17:00
・Venue: Tokyo Large Sight, East Corridor
　*TOPPAN will take part in JPCA Present 2024 (East Corridor 3/sales space 3A-28)
・Organizers: Japan Electronics Packaging and Circuits Affiliation, Japan Institute of Electronics Packaging, Japan Robotic Affiliation
・Official web site: https://www.jpcashow.com/show2024/en/exhibition/index.html

Concerning the TOPPAN Group

Established in Tokyo in 1900, the TOPPAN Group is a number one and diversified international supplier dedicated to delivering sustainable, built-in options in fields together with printing, communications, safety, packaging, décor supplies, electronics, and digital transformation. The TOPPAN Group’s international group of greater than 50,000 workers gives optimum options enabled by industry-leading experience and applied sciences to deal with the various challenges of each enterprise sector and society and contribute to the achievement of shared sustainability targets.
https://www.holdings.toppan.com/en/
https://www.linkedin.com/company/toppan/

Launch ID: 89132494

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